VINSE is excited to announce that the Heidelberg 渭MLA Maskless Aligner is available to users in the cleanroom. This new direct-write photolithography tool has a faster write speed than our old tool, is compatible with both positive and negative photoresists, has a Draw Mode that allows real-time adjustments to existing patterns and electrical contacts, and can be used to make masks that are compatible with the VINSE Karl Suss MA-6 Mask Aligner to enable higher throughput wafer-scale patterning. The 渭MLA Maskless Aligner supports rapid prototyping for research ranging from high power and high frequency semiconductor devices to microfluidic lab-on-a-chip devices. For training and access information, please visit: Heidelberg 渭MLA Maskless Aligner